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10M08SAE144C8G

10M08SAE144C8G

10M08SAE144C8G

Intel

FPGAs MAX® 10 Series 144-LQFP Exposed Pad 144

SOT-23

10M08SAE144C8G Datasheet

non-compliant

In-Stock: 3718 items
Specifications
Name Value
Type Parameter
Factory Lead Time 11 Weeks
Mounting Type Surface Mount
Package / Case 144-LQFP Exposed Pad
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series MAX® 10
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 144
Terminal Finish Matte Tin (Sn) - annealed
HTS Code 8542.39.00.01
Voltage - Supply 2.85V~3.465V
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PQFP-G144
Number of I/O 101
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 8000
Total RAM Bits 387072
Number of LABs/CLBs 500
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $21.78000 $21.78
25 $17.42000 $435.5
100 $16.99010 $1699.01
500 $16.34006 $8170.03
10M08SAE144C8G Product Details

10M08SAE144C8G Description


Power-efficient dual-mode transceivers with 57.8 Gbps PAM4 (Pulse Amplitude Modulation) and 28.9 Gbps NRZ (Non Return to Zero) operation are available in Intel® Stratix® 10 TX FPGAs. These devices can provide over 8 Tbps of aggregate bandwidth, fulfilling the strict transceiver bandwidth and power budget constraints of next-generation designs thanks to hardened PCI Express Gen 3 and 10/25/100 Gbps Ethernet MAC IP blocks.

The 57.8 Gbps PAM4 / 28.9 Gbps NRZ dual-mode transceivers are only one ground-breaking innovation included in the Intel Stratix 10 TX devices' list of advanced features. These include Intel's Embedded Multi-die Interconnect Bridge-based advanced packaging technology, protected external memory controllers, hardened floating point DSP blocks, and an entirely new HyperFlex® core architecture (EMIB).



10M08SAE144C8G Features


All new Intel Hyperflex™ core architecture delivering 2X the core performance compared to previous generation high-performance FPGAs

Intel 14 nm tri-gate (FinFET) technology

Heterogeneous 3D System-in-Package (SiP) technology

Monolithic core fabric with up to 2.8 million logic elements (LEs)

Up to 144 full duplex transceiver channels on heterogeneous 3D SiP transceiver tiles

Transceiver data rates up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ for chip-to-chip, chip-to-module, and backplane applications

Embedded eSRAM (47.25 Mbit) in select devices, and M20K (20 Kb) internal SRAM memory blocks

Fractional synthesis and ultra-low jitter LC tank based transmit phase locked loops (PLLs)

Hard PCI Express® Gen3 x16 intellectual property (IP) blocks

Hard 10/25/100 Gbps Ethernet MAC with dedicated Reed-Solomon FEC for NRZ signals (528, 514) and PAM4 signals (544, 514)



10M08SAE144C8G Applications


Temperature Measurement

Pressure Measurement

Flow Meters

Factory Automation and Process Control


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