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10M04SAE144C8G

10M04SAE144C8G

10M04SAE144C8G

Intel

FPGAs MAX? 10 Series 144-LQFP Exposed Pad 144

SOT-23

10M04SAE144C8G Datasheet

non-compliant

In-Stock: 2900 items
Specifications
Name Value
Type Parameter
Factory Lead Time 11 Weeks
Mounting Type Surface Mount
Package / Case 144-LQFP Exposed Pad
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series MAX® 10
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 144
HTS Code 8542.39.00.01
Voltage - Supply 2.85V~3.465V
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PQFP-G144
Number of I/O 101
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 4000
Total RAM Bits 193536
Number of LABs/CLBs 250
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $15.66000 $15.66
25 $12.53000 $313.25
100 $12.21010 $1221.01
500 $11.75006 $5875.03
10M04SAE144C8G Product Details

10M04SAE144C8G Overview


There are two packages that contain fpga chips: 144-LQFP Exposed Pad package and X package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. There are 101 I/Os for better data transfer. A fundamental building block is made up of 4000 logic elements/cells. An FPGA module can be attached to a development board with a Surface Mount-pin. In order to operate it, it requires a voltage supply of 2.85V~3.465V . An FPGA belonging to the MAX? 10 series is referred to as an FPGA. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. In order to save space, this FPGA model has been contained in Tray. Total terminations are 144. A device like this one offers 193536 RAM bits, which is a considerable amount of memory. 250 LABs and CLBs are built into this FPGA.

10M04SAE144C8G Features


101 I/Os
Up to 193536 RAM bits

10M04SAE144C8G Applications


There are a lot of Intel 10M04SAE144C8G FPGAs applications.

  • Aerospace and Defense
  • Electronic Warfare
  • Telecommunication
  • Medical imaging
  • Data center hardware accelerators
  • Enterprise networking
  • Solar Energy
  • Military DSP
  • Wired Communications
  • Space Applications

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