10M02DCU324C8G Overview

There are two packages that contain fpga chips: 324-LFBGA package and X package. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. Fpga chips is programmed wFpga chipsh 160 I/Os for transferring data in a more coherent manner. Logic blocks consist of 2000 logic elements/cells. An electrical supply voltage of 1.2V powers it. The Field Programmable Gate Arrays family of FPGAs includes this part. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 1.15V~1.25V battery. An FPGA belonging to the MAX? 10 series is referred to as an FPGA. Operating temperatures should be maintained within the 0°C~85°C TJ range at all times when the unit is in use. In this device, 160 outputs are incorporated in order to provide you with maximum flexibility. There is an FPGA model contained in Tray in order to conserve space. In total, it has 324 terminations on each end. This device has 110592 RAM bits, which is the number of RAM bits that this device offers. 125 LABs and CLBs are built into this FPGA. This is a battery operated device that operates on 1.2V.

10M02DCU324C8G Features

160 I/Os
Up to 110592 RAM bits

10M02DCU324C8G Applications

There are a lot of Intel 10M02DCU324C8G FPGAs applications.

• Data center search engines
• Defense Applications
• Automotive
• Telecommunication
• Automation
• Video & Image Processing
• Filtering and communication encoding
• Development Boards and Shields for Microcontrollers
• ADAS
• Data Mining