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10AX115S4F45I3SGES

10AX115S4F45I3SGES

10AX115S4F45I3SGES

Intel

3.65mm mm FPGAs Arria 10 GX Series 1932-BBGA, FCBGA 1mm mm

SOT-23

10AX115S4F45I3SGES Datasheet

non-compliant

In-Stock: 3005 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 1932-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Arria 10 GX
Part Status Discontinued
Moisture Sensitivity Level (MSL) 3 (168 Hours)
HTS Code 8542.39.00.01
Voltage - Supply 0.87V~0.93V
Terminal Position BOTTOM
Terminal Form BALL
Supply Voltage 0.9V
Terminal Pitch 1mm
JESD-30 Code S-PBGA-B1932
Number of I/O 624
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 1150000
Total RAM Bits 68857856
Number of LABs/CLBs 427200
Height Seated (Max) 3.65mm
Length 45mm
Width 45mm
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
10AX115S4F45I3SGES Product Details

10AX115S4F45I3SGES Overview


There are two packages that contain fpga chips: 1932-BBGA, FCBGA package and X package. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. Having 624 I/Os makes data transfers more coherent. In order to construct a fundamental building block, 1150000 logic elements/cells are required. Supply voltage is 0.9V volts. An FPGA module can be attached to a development board with a Surface Mount-pin. This device is powered by a 0.87V~0.93V battery. It is a type of FPGA belonging to the Arria 10 GX seies. During the operation of the system, the operating temperature should remain within the range of -40°C~100°C TJ. A model of this FPGA is contained in Tray for the purpose of saving space. Fpga electronics is worth mentioning that this device provides 68857856 bfpga electronics s of RAM. 427200 LABs/CLBs are configured on this FPGA.

10AX115S4F45I3SGES Features


624 I/Os
Up to 68857856 RAM bits

10AX115S4F45I3SGES Applications


There are a lot of Intel 10AX115S4F45I3SGES FPGAs applications.

  • Wired Communications
  • Medical ultrasounds
  • Embedded Vision
  • Automotive advanced driver assistance systems (ADAS)
  • Ecosystem
  • Filtering and communication encoding
  • Data Mining
  • Aerospace and Defense
  • High Performance Computing
  • Device controllers

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