10AX115S3F45I2SGE2 Overview

A 1932-BBGA, FCBGA package is provided with this component. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. Its 624 I/Os help it transfer data more efficiently. A fundamental building block contains 1150000 logic elements or cells. Supply voltage is 0.9V volts. An FPGA module can be attached to a development board with a Surface Mount-pin. This device is powered by a 0.87V~0.93V battery. As part of the Arria 10 GX series of FPGAs, it is a type of FPGA. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of -40°C~100°C TJ when operating the machine. As a space-saving measure, this FPGA model is contained within Tray. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 68857856 bFpga chipss. The FPGA is built as an array of 427200 latches or CLBs.

10AX115S3F45I2SGE2 Features

624 I/Os
Up to 68857856 RAM bits

10AX115S3F45I2SGE2 Applications

There are a lot of Intel 10AX115S3F45I2SGE2 FPGAs applications.

• Camera time adjustments
• Development Boards and Shields for Microcontrollers
• Aerospace and Defense
• Solar Energy
• Defense Applications
• Bioinformatics
• Enterprise networking
• Military Temperature
• Video & Image Processing
• OpenCL