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10AX115R3F40I2SGES

10AX115R3F40I2SGES

10AX115R3F40I2SGES

Intel

3.5mm mm FPGAs Arria 10 GX Series 1517-BBGA, FCBGA 1mm mm

SOT-23

10AX115R3F40I2SGES Datasheet

non-compliant

In-Stock: 3408 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 1517-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Arria 10 GX
Part Status Discontinued
Moisture Sensitivity Level (MSL) 3 (168 Hours)
HTS Code 8542.39.00.01
Voltage - Supply 0.87V~0.93V
Terminal Position BOTTOM
Terminal Form BALL
Supply Voltage 0.9V
Terminal Pitch 1mm
JESD-30 Code S-PBGA-B1517
Number of I/O 342
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 1150000
Total RAM Bits 68857856
Number of LABs/CLBs 427200
Height Seated (Max) 3.5mm
Length 40mm
Width 40mm
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
10AX115R3F40I2SGES Product Details

10AX115R3F40I2SGES Overview


In the 1517-BBGA, FCBGA package, you will find fpga chips. There are FIELD PROGRAMMABLE GATE ARRAY transistors in this type of FPGA. Having 342 I/Os makes data transfers more coherent. The basic building blocks of logic contain 1150000 logic elements/cells. In order for the device to operate, a supply voltage of 0.9V volts needs to be provided. Using a Surface Mount connector, you can mount this FPGA module on the development board. Fpga chips operates at a voltage of 0.87V~0.93V and uses a battery to supply power. This is a type of FPGA that is part of the Arria 10 GX series of FPGAs. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of -40°C~100°C TJ when operating the machine. As a space-saving measure, this FPGA model is contained within Tray. The RAM bits that are offered by this fpga chips are 68857856. An array of 427200 LABs/CLBs is built into the FPGA.

10AX115R3F40I2SGES Features


342 I/Os
Up to 68857856 RAM bits

10AX115R3F40I2SGES Applications


There are a lot of Intel 10AX115R3F40I2SGES FPGAs applications.

  • Development Boards and Shields for Microcontrollers
  • Scientific Instruments
  • Space Applications
  • Wireless Communications
  • Ecosystem
  • Automotive
  • Military Temperature
  • Enterprise networking
  • Secure Communication
  • Data Center

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