10AX115N3F40I3SGES Overview

Fpga chips is supplied in the 1517-BBGA, FCBGA package. This device features 600 I/Os in order to transfer data in a more efficient manner. A fundamental building block contains 1150000 logic elements or cells. This FPGA module can be attached to the development board with a Surface Mount. In order to operate it, it requires a voltage supply of 0.87V~0.93V . This is a type of FPGA that is part of the Arria 10 GX series of FPGAs. During the operation of the system, the operating temperature should remain within the range of -40°C~100°C TJ. As a result of space limitations, this FPGA model has been included in Tray. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 68857856 bFpga chipss. Fpga electronics contains 427200 LABs/CLBs in an array. 1517-FCBGA (40x40) stands for its supplier device package.

10AX115N3F40I3SGES Features

600 I/Os
Up to 68857856 RAM bits

10AX115N3F40I3SGES Applications

There are a lot of Intel 10AX115N3F40I3SGES FPGAs applications.

• Automation
• Scientific Instruments
• ASIC prototyping
• Defense Applications
• Ecosystem
• Cryptography
• High Performance Computing
• Digital signal processing
• Software-defined radio
• Solar Energy