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10AX115N1F45I1SG

10AX115N1F45I1SG

10AX115N1F45I1SG

Intel

3.65mm mm FPGAs Arria 10 GX Series 1932-BBGA, FCBGA 1mm mm

SOT-23

10AX115N1F45I1SG Datasheet

non-compliant

In-Stock: 1664 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 1932-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Arria 10 GX
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
HTS Code 8542.39.00.01
Voltage - Supply 0.87V~0.98V
Terminal Position BOTTOM
Terminal Form BALL
Supply Voltage 0.9V
Terminal Pitch 1mm
JESD-30 Code S-PBGA-B1932
Number of I/O 768
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 1150000
Total RAM Bits 68857856
Number of LABs/CLBs 427200
Height Seated (Max) 3.65mm
Length 45mm
Width 45mm
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
10AX115N1F45I1SG Product Details

10AX115N1F45I1SG Overview


There are two packages that contain fpga chips: 1932-BBGA, FCBGA package and X package. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. The device has 768 I/O ports for more coherent data transfer. Logic blocks consist of 1150000 logic elements/cells. It is powered from a supply voltage of 0.9V. This FPGA module can be attached to the development board with a Surface Mount. In order for it to operate, the supply voltage must be 0.87V~0.98V . The Arria 10 GX Series is one of the types of FPGAs that belong to this type. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. It is for space saving reasons that this FPGA model is contained in Tray. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 68857856 bFpga chipss. This FPGA is built as an array of 427200 LABs/CLBs.

10AX115N1F45I1SG Features


768 I/Os
Up to 68857856 RAM bits

10AX115N1F45I1SG Applications


There are a lot of Intel 10AX115N1F45I1SG FPGAs applications.

  • Medical imaging
  • Military Temperature
  • Filtering and communication encoding
  • High Performance Computing
  • ASIC prototyping
  • DO-254
  • Medical Electronics
  • Wireless Communications
  • Solar Energy
  • Secure Communication

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