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10AX090N2F40I1SG

10AX090N2F40I1SG

10AX090N2F40I1SG

Intel

3.5mm mm FPGAs Arria 10 GX Series 1517-BBGA, FCBGA 1mm mm

SOT-23

10AX090N2F40I1SG Datasheet

non-compliant

In-Stock: 2622 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 1517-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Arria 10 GX
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
HTS Code 8542.39.00.01
Voltage - Supply 0.87V~0.98V
Terminal Position BOTTOM
Terminal Form BALL
Supply Voltage 0.9V
Terminal Pitch 1mm
JESD-30 Code S-PBGA-B1517
Number of I/O 600
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 900000
Total RAM Bits 59234304
Number of LABs/CLBs 339620
Height Seated (Max) 3.5mm
Length 40mm
Width 40mm
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
10AX090N2F40I1SG Product Details

10AX090N2F40I1SG Overview


In the 1517-BBGA, FCBGA package, you will find fpga chips. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. This device features 600 I/Os in order to transfer data in a more efficient manner. A fundamental building block contains 900000 logic elements or cells. It is powered from a supply voltage of 0.9V. Using a Surface Mount connector, you can mount this FPGA module on the development board. In order for it to operate, the supply voltage must be 0.87V~0.98V . The Arria 10 GX Series is one of the types of FPGAs that belong to this type. As far as the operating temperature is concerned, it should be kept within -40°C~100°C TJ when operating. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. Fpga electronics is worth mentioning that this device provides 59234304 bfpga electronics s of RAM. 339620 LABs/CLBs are configured on this FPGA.

10AX090N2F40I1SG Features


600 I/Os
Up to 59234304 RAM bits

10AX090N2F40I1SG Applications


There are a lot of Intel 10AX090N2F40I1SG FPGAs applications.

  • Distributed Monetary Systems
  • Data center hardware accelerators
  • Automation
  • Broadcast
  • Wired Communications
  • Medical Applications
  • Medical ultrasounds
  • Artificial intelligence (AI)
  • Solar Energy
  • Defense Applications

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