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10AX048E1F29I1SG

10AX048E1F29I1SG

10AX048E1F29I1SG

Intel

3.35mm mm FPGAs Arria 10 GX Series 780-BBGA, FCBGA 1mm mm 780

SOT-23

10AX048E1F29I1SG Datasheet

non-compliant

In-Stock: 3674 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 780-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Arria 10 GX
Part Status Discontinued
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 780
HTS Code 8542.39.00.01
Voltage - Supply 0.87V~0.98V
Terminal Position BOTTOM
Terminal Form BALL
Supply Voltage 0.9V
Terminal Pitch 1mm
JESD-30 Code S-PBGA-B780
Number of I/O 360
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 480000
Total RAM Bits 5664768
Number of LABs/CLBs 183590
Height Seated (Max) 3.35mm
Length 29mm
Width 29mm
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
10AX048E1F29I1SG Product Details

10AX048E1F29I1SG Overview


A 780-BBGA, FCBGA package contains it, and it is available for download. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. Having 360 I/Os makes data transfers more coherent. A fundamental building block contains 480000 logic elements or cells. Supply voltage is 0.9V volts. The Surface Mount-slot on the development board allows you to attach the FPGA module. The supply voltage of the device is 0.87V~0.98V , at which it runs. As part of the Arria 10 GX series of FPGAs, it is a type of FPGA. Operating temperatures should be maintained within the -40°C~100°C TJ range at all times when the unit is in use. As a result of space limitations, this FPGA model has been included in Tray. In total, it has a total of 780 terminations. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 5664768 bFpga chipss. A total of 183590 LABs/CLBs are included in this FPGA.

10AX048E1F29I1SG Features


360 I/Os
Up to 5664768 RAM bits

10AX048E1F29I1SG Applications


There are a lot of Intel 10AX048E1F29I1SG FPGAs applications.

  • Integrating multiple SPLDs
  • Enterprise networking
  • Data Mining
  • Security systems
  • Solar Energy
  • Medical Applications
  • Defense Applications
  • Automotive Applications
  • Distributed Monetary Systems
  • DO-254

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