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10AX027E1F27I1SG

10AX027E1F27I1SG

10AX027E1F27I1SG

Intel

3.25mm mm FPGAs Arria 10 GX Series 672-BBGA, FCBGA 1mm mm 672

SOT-23

10AX027E1F27I1SG Datasheet

non-compliant

In-Stock: 3632 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 672-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Arria 10 GX
Part Status Discontinued
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 672
HTS Code 8542.39.00.01
Voltage - Supply 0.87V~0.98V
Terminal Position BOTTOM
Terminal Form BALL
Supply Voltage 0.9V
Terminal Pitch 1mm
JESD-30 Code S-PBGA-B672
Number of I/O 240
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 270000
Total RAM Bits 17870848
Number of LABs/CLBs 101620
Height Seated (Max) 3.25mm
Length 27mm
Width 27mm
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
10AX027E1F27I1SG Product Details

10AX027E1F27I1SG Overview


There are two packages that contain fpga chips: 672-BBGA, FCBGA package and X package. FIELD PROGRAMMABLE GATE ARRAY is the component of this type of FPGA. Having 240 I/Os makes data transfers more coherent. A fundamental building block contains 270000 logic elements or cells. 0.9V volts power it. Using a Surface Mount connector, you can mount this FPGA module on the development board. Fpga chips operates wFpga chipsh a supply voltage of 0.87V~0.98V. This is a type of FPGA that is part of the Arria 10 GX series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin -40°C~100°C TJ when the device is operating. A model of this FPGA is contained in Tray for the purpose of saving space. Fpga chips is designed wFpga chipsh 672 terminations. This device is equipped with 17870848 RAM bits in terms of its RAM si17870848e. Fpga electronics contains 101620 LABs/CLBs in an array.

10AX027E1F27I1SG Features


240 I/Os
Up to 17870848 RAM bits

10AX027E1F27I1SG Applications


There are a lot of Intel 10AX027E1F27I1SG FPGAs applications.

  • Bioinformatics
  • Wired Communications
  • Development Boards and Shields for Microcontrollers
  • Filtering and communication encoding
  • Digital signal processing
  • Telecommunication
  • Integrating multiple SPLDs
  • Automotive driver's assistance
  • Wireless Communications
  • Server Applications

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