10AX016E3F27E1HG Overview

This package is included in the 672-BBGA, FCBGA package and is available for purchase. Having 240 I/Os makes data transfers more coherent. To form a fundamental building block, there are 160000 logic elements/cells. Using a Surface Mount connector, you can mount this FPGA module on the development board. Fpga chips operates at a voltage of 0.87V~0.93V and uses a battery to supply power. The FPGA belongs to the Arria 10 GX series of FPGAs, and it is one type of FPGA. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~100°C TJ when the device is operating. There is an FPGA model contained in Tray in order to conserve space. This device is equipped with 10086400 RAM bits in terms of its RAM si10086400e. An array of 61510 LABs/CLBs is built into the FPGA. 672-FBGA (27x27) stands for its supplier device package.

10AX016E3F27E1HG Features

240 I/Os
Up to 10086400 RAM bits

10AX016E3F27E1HG Applications

There are a lot of Intel 10AX016E3F27E1HG FPGAs applications.

• Secure Communication
• Integrating multiple SPLDs
• Automotive Applications
• Distributed Monetary Systems
• Automotive
• Software-defined radios
• Security systems
• Military Temperature
• Server Applications
• Camera time adjustments