0 votes
by (120 points)
What is package substrate?

1 Answer

0 votes
by (160 points)
Embedded Multi-die Interconnect Bridge (EMIB) is an elegant and cost-effective approach to in-package high density interconnect of heterogeneous chips. ... Instead of using a large silicon interposer typically found in other 2.5D approaches, EMIB uses a very small bridge die, with multiple routing layers.

Related questions

0 votes
1 answer
asked Aug 16, 2021 by hdp (120 points)
0 votes
1 answer
0 votes
0 answers
0 votes
0 answers
0 votes
1 answer
0 votes
1 answer
0 votes
1 answer
0 votes
1 answer
asked Nov 28, 2019 by should (820 points)
0 votes
1 answer
0 votes
1 answer
...