25LC128
Hotenda Part Number
H2403527
Manufacturer Part
XC7Z045-3FBG676E
Manufacturer
Xilinx
Description
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 350K Logic Cells 256KB 1GHz 676-FCBGA (27x27)
Category
Integrated Circuits (ICs)
Family
System On Chip Embedded
Series
-
Manufacturer Quantity
4551
Datasheets Online
-
Price & Packaging & Delivery
Quantity
Unit Price
Ext. Price
1
$1.00
$1.00

Attention: The price is for reference only , pls send us RFQs for the update price.

Packaging: Regular packing reel, tube, tray, box and etc.

Delivery: Shipping can be arranged ASAP since payment received

Inquiry
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  • Delivery date: usually 2 to 7 working days.
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Datasheets
Zynq-7000 All Programmable SoC Overview
XC7Z030,35,45,100 Datasheet
Zynq-7000 Errata
Zynq-7000 User Guide
Featured Product
Zynq®-7 SoC
PCN Assembly/Origin
Additional Wafer Fabrication 16/Dec/2013
Substrate Supplier Addition 03/Nov/2014
PCN Design/Specification
Zynq-7000 Datasheet Update 02/Jun/2014
Zynq-7000 AP Requirement 28/Sep/2015
Product Training Modules
Powering Series 7 Xilinx FPGAs with TI Power Management Solutions
Architecture
MCU, FPGA
Category
Integrated Circuits (ICs)
Connectivity
CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Family
Embedded - System On Chip (SoC)
MCU Flash
-
MCU RAM
256KB
Manufacturer
Xilinx Inc.
Number of I/O
130
Operating Temperature
0°C ~ 100°C (TJ)
Package / Case
676-BBGA, FCBGA
Packaging
Tray
Part Status
Active
Peripherals
DMA
Primary Attributes
Kintex™-7 FPGA, 350K Logic Cells
Series
Zynq®-7000
Speed
1GHz
Supplier Device Package
676-FCBGA (27x27)

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