25LC128
Hotenda Part Number
H2403159
Manufacturer Part
M2S060T-FG676I
Manufacturer
Microsemi SoC
Description
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 60K Logic Modules 256KB 64KB 166MHz 676-FBGA (27x27)
Category
Integrated Circuits (ICs)
Family
System On Chip Embedded
Series
-
Manufacturer Quantity
4183
Datasheets Online
-
Price & Packaging & Delivery
Quantity
Unit Price
Ext. Price
40
$3.10
$124.09

Attention: The price is for reference only , pls send us RFQs for the update price.

Packaging: Regular packing reel, tube, tray, box and etc.

Delivery: Shipping can be arranged ASAP since payment received

Inquiry
  • FedEx, DHL, and UPS can be selected.
  • You can select whether to charge shipping fee by your shipping account or to charge by our side.
  • Please confirm with the logistics company in advance if you are in a remote area. (It may cost extra fees (35-50 USD) for delivery at those areas.)
  • The shopping cart will automatically calculate the shipping cost.
  • Delivery time: At the same day (Order deadline is 2pm, HK Time).
  • Delivery date: usually 2 to 7 working days.
  • It is unable to appoint a date of delivery.
  • Tracking number will be sent once your order has been shipped. (Package Tracking) (It may take up to 24 hours before carriers display the info.)
  • PayPal, Credit Card, TT in advance (bank transfer), Western Union can be chosen.
  • Cash transfer only. (Transfer with checks and bills are not accepted.)
  • Customer is responsible for paying all possible charges, including sales tax, VAT and customs charges,etc.
  • If you need the detailed invoice or tax ID, please email us.
Datasheets
IGL002 FPGA,SmartFusion2 Datasheet
SmartFusion2 Product Brief
PCN Design/Specification
Multiple Changes 17/Sep/2015
Lock Setting Chg 11/May/2016
Timing Chg 17/May/2016
Timing Chg 17/May/2016
Architecture
MCU, FPGA
Category
Integrated Circuits (ICs)
Connectivity
CAN, Ethernet, I²C, SPI, UART/USART, USB
Core Processor
ARM® Cortex®-M3
Family
Embedded - System On Chip (SoC)
MCU Flash
256KB
MCU RAM
64KB
Manufacturer
Microsemi Corporation
Number of I/O
387
Operating Temperature
-40°C ~ 100°C (TJ)
Package / Case
676-BGA
Packaging
Tray
Part Status
Active
Peripherals
DDR, PCIe, SERDES
Primary Attributes
FPGA - 60K Logic Modules
Series
SmartFusion®2
Speed
166MHz
Supplier Device Package
676-FBGA (27x27)
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