Up to 10 million yuan in funding, Shenzhen Pingshan is good for third-generation semiconductor development

By EverSpin Technologies, Inc.


Recently, Pingshan District of Shenzhen City issued the 2019 annual economic development special fund integrated circuit third-generation semiconductor special application guidelines, proposed to provide qualified IC companies with credit financing, housing, settlement, core technology and product research and other aspects of funding stand by.

In terms of settlement, Pingshan District has newly established or newly moved design, equipment and materials-based integrated circuit enterprises, which have established or moved in the first year or the first fiscal year, and the paid-up capital exceeds 20 million yuan. The enterprise shall grant a maximum of 5 million yuan to each enterprise according to 10% of the paid-up capital in the first year or the first fiscal year after the establishment; for the newly moved enterprise, according to the first year or the first after the move 10% of the paid-up capital is added in the fiscal year, and each company is given a grant of up to 5 million yuan.

In the special fund for the establishment, awarding and testing of enterprises, Pingshan District has completed the newly established or newly moved manufacturing, packaging and testing integrated circuit enterprises, and actually completed industrial investment of more than 50 million yuan in the first year or the first fiscal year (including In accordance with the actual amount of industrial investment completed by the enterprise in the current year, 10% of each enterprise is given a grant of up to 10 million yuan.

In supporting the core technology and product research special support, Pingshan District supports enterprises to develop high-end general-purpose devices (CPU, GPU, memory, etc.), third-generation semiconductor devices (power semiconductor devices, etc.), key equipment (lithography machine, engraving) Technology development and product research, such as etching machine, ion implanter, vapor deposition equipment, core materials (third-generation semiconductor materials, targets, photoresists, photoresists, etc.), advanced processes (stacked packages, etc.) 10% of R&D investment is given to each company with a maximum of 5 million yuan per year.

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