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Hotenda Technology is one of the industry's fastest growing global catalog and online semiconductor and electronic component distributors.
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This article introduces some GNSS modules and explains how to use them as the basis for real time location systems (RTLS). The article shows how the modules are set up for maximum sensitivity, communication with the host microcontroller, rapid satellite acquisition, and optimal power efficiency.
The current consumption for the full 5 meter length of LED ribbon is about 5 amps (A). One meter draws about 1 A, so the 2 x 50 mm length of LED ribbon draws about 100 mA.
Semiconductor parameter testing is a very important part of basic research and application research in microelectronics, materials, physics, etc. High-precision instruments are completely monopolized by foreign companies. Traditional test instruments are expensive, software and test functions are single and inconvenient to expand.
The Korea Statistics Bureau recently announced that the country’s semiconductor manufacturing industry’s operating ratio index for the previous month was 97.1, which fell below 100 for the first time in August 2015, down 4% from the previous month, hitting a three-and-a-half-year low, and the Korean semiconductor industry is In an unfavorable situation.
A number of semiconductor manufacturers expect that the semiconductor boom is expected to leave the bottom of the season. A number of wafer fabrication plants, semiconductor materials and equipment plants, including TSMC, Wanghong, Global Crystal, South Asia Branch, Jingding and Chongyue Electric, believe that demand will pick up in the second half of the year, driving the overall semiconductor industry out of the downturn and gradually climbing.
The resistor is a passive electrical component to create resistance in the flow of electric current. In almost all electrical networks and electronic circuits they can be found. The resistance is measured in ohms.
Performance summary: In 2018, the company achieved operating income of 590 million yuan, a year-on-year increase of 23.7%; the net profit attributable to shareholders of listed companies was 90.978 million yuan, an increase of 13.3%. In the report period
On April 18th, the first quarter of “Beijing Changrong Project” and the 2019 Beijing 5G Industry and Financial Development Forum were held in Shunyi District. At the meeting, Huaxin Semiconductor Beijing Research Institute, Zhidao Network Technology (Beijing) Co., Ltd., Skyworth Group Beijing Research Institute, and intelligent networked automobile characteristic town project were signed and settled in Shunyi.
According to a Reuters quoted by people familiar with the matter, SK hynix, a Korean memory maker, is considering acquiring the capacity of some of its logic chip maker MagnaChip to expand its 8-inch wafer production line.
According to Gartner's latest data, global semiconductor revenues totaled $474.6 billion in 2018, an increase of 12.5% from 2017. The decline in semiconductor revenue growth in 2018 (21.9% in 2017) was due to a slowdown in memory growth to 24.9% (2017 growth rate of 61.8%).
In a report released on the 14th, CICC pointed out that since the price fluctuation of Bitcoin directly affects the development of the relevant semiconductor industry chain, if the price of the currency continues to rise, the demand of the semiconductor industry will be very worthy of attention.
Both the Korean government and representatives of the Korean semiconductor industry have launched plans to increase investment in non-storage semiconductors, both in anticipation of good market prospects and factors that are overly dependent on memory chips.
HiSilicon Technologies Co., a chip design subsidiary of Huawei Technologies Co., has recently become one of the largest and most advanced chip companies in China. Experts pointed out that Huawei and Haisi were listed in the blacklist of exports by the United States. Although the impact in the short term is not large, the long-term chip research and development capabilities are threatened.
As the industry's fastest growing global catalog and online semiconductor and electronic component distributors.Hotenda Technology Co.,Ltd obtained the ISO9001 quality management system certificate on May 27, 2019.Certificate No.30419Q00958R0S.The scope of certification is related management activities involved in the sale of electronic components .
According to a Reuters report, according to a senior US official, the US government may approve the company to restart its license to sell new products to Huawei in the shortest two weeks, marking the recent downgrade of US President Trump to Chinese companies. Efforts to limit are speeding up.
7nm has not yet become the mainstream of today's chips, and 5nm chips are already being developed and mass-produced. It is reported that TSMC's new 5nm chip manufacturing process will begin mass production in the first half of 2020, making the first batch of 5nm chips available at this time next year.
Intel released Pohoiki Beach, an accelerator card based on its neuromorphic computing chip Loihi, which contains 64 Loihi chips containing more than eight million neurons.
China produces more than 95% of the world's raw material gallium. Gallium is a soft, light blue metal used to make chipsets that generate high-frequency radio waves at 5G base stations.
From the predictions of major authoritative research institutions, the semiconductor industry is not optimistic in 2019.
Samsung announced at the 2019 Samsung Foundry Forum in Santa Clara, USA on May 14th that it will complete GAA process development next year and begin mass production in 2021.
Qualcomm said that due to Sino-US trade disputes, its business was affected by the “OEM share turned to Huawei”
In terms of speed, processing power, support for a large number of peripherals, memory, etc., most 8-bit mcu does not match 32-bit mcu, but 8-bit mcu is still more suitable for devices that do not require a lot of features and high processing speed.
According to the news, Hubble Technology Investment Co., Ltd., a subsidiary of Huawei, recently invested in Shandong Tianyue Advanced Materials Technology Co., Ltd., holding 10%.
Micron, the world's third-largest memory chip maker, will invest up to NT$400 billion (approximately RMB90.9 billion) in Taichung to build two A4 and A5 fabs, using the next generation of the latest process technology to produce DRAM.
After about 2000, the third generation of semiconductor-related patent applications began to enter a stage of rapid growth.The number of applications in China exceeded the United States for the first time in 2010.
Agilex is a combination of Agile and Flexible, and these two features are the two core points of modern FPGA technology
China is now a huge semiconductor market, accounting for one-third of semiconductor sales in 2018.
It is expected that with the widespread use of IoT and AI, the growth rate of analog ICs will accelerate
Trade tensions between China and the United States may worsen the already slowing semiconductor industry situation
This technology uses a metal organic framework material consisting of structured nanopores. In the long run, this approach can be used to develop chips that are smaller, more powerful, and consume less power
The acquisition has enabled Qualcomm to gain more than 20 years of expertise and accumulation in RF front-end filtering technology
According to statistics, North American semiconductor equipment manufacturers shipped $2,034 million in July, up 1% from the previous month and down 15% from the same period of last year. The decline was significantly lower than that of January-June this year.
The new four STM32G0 microcontrollers are the perfect combination of 8-pin economy and 32-bit performance, unique in the market
The proximity sensor is a device that has the ability to sense the proximity of an object, and can replace the contact detection method such as a limit switch. it is a general term for a sensor that does not need to contact the detection object for detection.
Semiconductor industry stakeholders expect that semiconductor prices this year have probably fallen to a minimum, inventory is almost exhausted, NAND flash memory has begun to pick up, DRMA demand will slowly recover.
Toshiba Electronic Components and Storage Co., Ltd. ("Toshiba") announced the introduction of the dual-channel solenoid driver IC "TB67S112PG", which enables high-voltage, low-on-resistance driving.
COZIR-Blink consumes very low power compared to other CO2 sensors and has a long service life.
Dialog Semiconductor announced that it has signed a definitive agreement to acquire Creative Chips GmbH, an outstanding integrated circuit (IC) supplier for the industrial IoT market.
The sensor provides stable detection regardless of the distance detected, the color of the object, the material and the surface.
Arm's custom instructions for Armv8-M enable chip designers to further enhance performance and efficiency by adding application-specific features to small embedded processors while maintaining the ecosystem of Arm processors System advantage.
Designed for mainstream and entry-level notebooks and desktop PCs, the ACG1F is a low-cost, single-port USB-C controller for systems that need to convert legacy USB Type-A ports to USB Type-C ports.
It can be used to protect high-speed differential data lines from damage caused by electrostatic discharge (ESD), cable discharge (CDE), electrical fast transients (EFT), and lightning-induced surges, maintaining network communication reliability by maintaining signal integrity.
there are rumors that it will use Intel Gen11 graphics, which will greatly improve GPU performance.
Littelfuse introduces five high temperature alternistor triac switching thyristors to help designers improve thermal management
The SMB Flat package is rated at 600W, transient power is up to 1500W, and only 1.0mm thick SMA Flat The package's rated power and transient power are 400W and 600W, respectively.
Micron said it is refreshing two enterprise/data center-class solid-state drive (SSD) product lines, the 5300 and 7300 series with the latest 96-layer 3D TLC flash.
The sensor's measurement range is ±25A to ±120A and offers great design flexibility with individually programmable parameters such as current range, overcurrent threshold and output mode.
The Bourns® CB A series can withstand 6 A to 10 A at 60 ° C and can be spot welded or laser welded.
The RE product family is based on Renesas' unique SOTBTM (Silicon on Thin Buried Oxide) process, which significantly reduces operating and standby power consumption, eliminating the need for battery replacement or charging.
SmartBond TINY solves the challenge of increasing the size and cost of IoT devices. It reduces the cost of implementing a complete system with smaller chip sizes and footprints, and ensures that performance quality is comparable to that of competitors.
Using the latest MEMS technology, the MLX90821 is a system-in-package (SiP) solution that is tightly integrated into the same package as analog signal chain and digital signal processing technology, and is suitable for measuring fuel vapor pressures as low as 50 mbar and as high as 700 mbar.
the production capacity of MEMS/Sensor Fabs will increase by 25% between 2018 and 2023, and monthly production capacity increased to 4.7 million units (converted to 200nm wafers).
These new Layerscape Access processors are compliant with the O-RAN Alliance specification for a variety of deployment scenarios, including Central Unit/Distributed Unit (CU/DU) and Radio Unit (RU), as well as integrated small base stations and client equipment (CPE) system.
In addition to covering the frequency band below 1 GHz (400 MHz to 960 MHz), it also covers the 2.4 GHz band, providing universal compatibility. The LSI has very stable wireless characteristics even under varying environmental parameters such as voltage and temperature fluctuations.
The production capacity of 8-inch wafer chips has been obviously insufficient since 2018, and from the 2019, the 8-inch wafer production capacity remains, very nervous, especially in mainland China, in the case of a number of 12-inch production line, it seems that some 8-inch wafer capacity problems are ignored.
the new Microni300 1TB microSD card uses Micron's 96-layer 3D QLC NAND technology to capture and store high-quality video clips for more than three months in a video surveillance system.
Compared to the ASi-3, the ASi-5 offers superior performance and availability, with cycle times as low as 1.27ms, cable lengths up to 200 meters, and support for 96 slaves per segment.
The STTS22H can improve asset trackers, container transport recorders, HVAC HVAC systems, air humidifiers, refrigerators, building automation systems And smart consumer temperature and heat flow monitoring.
In 2019, the total amount of parts and components purchased by Huawei from Japanese companies will reach 1.1 trillion yen (about 10 billion US dollars), a surge of more than 50% from 720 billion yen in 2018.
In 2018, in the field of pan-industrial chips, fast-growing applications include network equipment, commercial aircraft, LED lighting, digital tags, digital video surveillance, climate monitoring, smart meters, photovoltaic inverters, and human-machine interface systems.
China has already started 5G services, and the accompanying 5G smartphones and related equipment will drive the global semiconductor market back to life.
Vishay Dale IHDF-1300AE-10 adopts iron powder core technology, with a maximum height of only 15.4 mm. It has low AC and DC power consumption and excellent heat dissipation in the severe operating temperature range of -55 ° C to +125 ° C. performance.
5G and 400G data centers are twin-type synchronous development. It is expected that with the gradual landing of high-broadband applications in the 5G era, the burst of traffic will be on the order of tens of times.
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