25LC128
Hotenda Part Number
H2506218
Manufacturer Part
MCP602-I/SN
Manufacturer
Microchip Technology
Description
General Purpose Amplifier 2 Circuit Rail-to-Rail 8-SOIC
Category
Integrated Circuits (ICs)
Family
Instrumentation Linear , Linear OP Amps, Linear Buffer Amps
Series
-
Manufacturer Quantity
7242
Datasheets Online
-
Price & Packaging & Delivery
Quantity
Unit Price
Ext. Price
1
$0.57
$0.57
25
$0.02
$0.48
100
$0.00
$0.43

Attention: The price is for reference only , pls send us RFQs for the update price.

Packaging: Regular packing reel, tube, tray, box and etc.

Delivery: Shipping can be arranged ASAP since payment received

Inquiry
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  • Delivery time: At the same day (Order deadline is 2pm, HK Time).
  • Delivery date: usually 2 to 7 working days.
  • It is unable to appoint a date of delivery.
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  • If you need the detailed invoice or tax ID, please email us.
Datasheets
MCP601, 2, 3, 4
Development Tools Catalog
EDA / CAD Models
Download from Accelerated Designs
Online Catalog
General Purpose
PCN Assembly/Origin
SOIC-8L Copper Bond Wire Revision 06/Feb/2014
Assembly Site Addition 08/Apr/2015
Assembly Site Addition 08/Apr/2015
PCN Design/Specification
SOIC-8L Copper Bond Wire 18/Sep/2013
SOIC-8L Copper Bond Wire 18/Dec/2013
Multiple Devices Datasheet Update 18/Aug/2014
CuPdAu Update 29/Jun/2015
PCN Packaging
Label and Packing Changes 23/Sep/2015
-3db Bandwidth
-
Amplifier Type
General Purpose
Category
Integrated Circuits (ICs)
Current - Input Bias
1pA
Current - Output / Channel
22mA
Current - Supply
230µA
Family
Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
Gain Bandwidth Product
2.8MHz
Manufacturer
Microchip Technology
Mounting Type
Surface Mount
Number of Circuits
2
Operating Temperature
-40°C ~ 85°C
Output Type
Rail-to-Rail
Package / Case
8-SOIC (0.154", 3.90mm Width)
Packaging
Tube
Part Status
Active
Series
-
Slew Rate
2.3 V/µs
Supplier Device Package
8-SOIC
Voltage - Input Offset
700µV
Voltage - Supply, Single/Dual (±)
2.7 V ~ 6 V
Other Names
MCP602ISN
Standard Package
100

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