S9S12DT12F1MPVE Documents | |
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Datasheets | MC9S12DJ64 Guide |
Design Resources | Development Tool Selector |
PCN Design/Specification | Copper Wirebond Material 09/Jun/2014 |
S9S12DT12F1MPVE Attributes | |
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Category | Integrated Circuits (ICs) |
Family | Embedded - Microcontrollers |
Manufacturer | Freescale Semiconductor - NXP |
Series | HCS12 |
Packaging | Tray |
Part Status | Active |
Core Processor | HCS12 |
Core Size | 16-Bit |
Speed | 25MHz |
Connectivity | CAN, I²C, SCI, SPI |
Peripherals | PWM, WDT |
Number of I/O | 91 |
Program Memory Size | 128KB (128K x 8) |
Program Memory Type | FLASH |
EEPROM Size | 2K x 8 |
RAM Size | 8K x 8 |
Voltage - Supply (Vcc/Vdd) | 2.35 V ~ 5.25 V |
Data Converters | A/D 16x10b |
Oscillator Type | Internal |
Operating Temperature | -40°C ~ 125°C (TA) |
Package / Case | 112-LQFP |
Supplier Device Package | 112-LQFP (20x20) |
Applications | E-mail for more information |
Alternative Part (Replacement Part) | S9S12DT12F1MPVE |
S9S12DT12F1MPVE Resources | |
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S9S12DT12F1MPVE Tags | S9S12D(15) S9S12(194) S9S1(194) S9S(390) |
Standard Package | 300 |
Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc.
Digi International