Molex Showcases High-Speed Interconnect Solutions at Supercomputing 2015

By Molex


Visit booth 268 for Molex next-gen data and storage I/O interconnect solutions

MsX Product Family from Molex

LISLE, IL – November 16, 2015 – Molex, LLC will present leading edge technologies for high-speed, high-density applications at the 27th Annual Supercomputing 2015 (SC15) international conference and exhibition, to be held November 15 - 20, 2015, at the Austin (Texas) Convention Center. SC15 is the international conference for high-performance computing, networking storage and analysis. Molex booth 268 at SC15 will feature demonstrations of the latest high-performance I/O solutions, including:

Impel™ Copper Cable Backplane (CCB) Solution – This high-speed cabled backplane solution delivers data rates of more than 40 Gbps and is for use in data centers, networking, telecom, and high-performance computing applications. The Impel CCB solution uses high-speed twinax cable and provides design engineers with the flexibility needed to develop cabled solutions for conventional cabled backplane, mid-plane, or custom cable tray applications. It integrates high speed and high density, offering up to 80 differential pairs/inch. The CCB solution has insertion loss of just 0.16dB/in.

100 Gbps CWDM4/CLR4 QSFP28 Transceivers – Molex and Oplink Communications, LLC, a Molex company, will show-case portfolio of 100 Gbps optical transceiver solutions and demonstrate latest CWDM4/CLR4 QSFP28 for large scale data center applications including InfiniBand and Ethernet.

Nano-Pitch I/O™ Interconnect System – Designed for next-generation, high-performance internal and external applications for anything from handheld devices up high performance storage systems. This interconnect system is capable of 25 Gbps per lane to satisfy PCI Express Gen 3 and SAS-4 interface standards. The small form factor enables more effective utilization of host card real estate and fits into places not possible with previous connector generations. The cable design of the Nano-Pitch I/O Interconnect System accommodates ribbon cables for improved cable management and better cooling performance within enclosures. The pin pattern provides the flexibility needed to implement 4x, 5x or 6x high-speed lanes, providing bandwidth up to 150 Gbps.

“At Molex, we are committed to providing optimal signal speed, design flexibility and scalability to propel next-generation system architecture solutions,” said Jay Neer, industry standards manager, Molex. “We are delighted to showcase these innovative, proven solutions.”

For more information please visit Molex in booth 268 during SC15 exhibition hours or www.molex.com/industry/datacomm_computing.html.

About Molex, LLC

Providing more than connectors, Molex delivers complete interconnect solutions for a number of markets including: data communications, telecommunications, consumer electronics, industrial, automotive, commercial vehicle, aerospace and defense, medical, and lighting. Established in 1938, Molex is a global company with a presence in more than 40 countries. The Molex website is http://www.molex.com. Follow us at www.twitter.com/molexconnectors, watch our videos atwww.youtube.com/molexconnectors, connect with us at www.facebook.com/molexconnectors and read our blog atwww.connector.com.

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