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This RF FEM's PA provides a highly adjustable TX power boost up to +21 dBm, while the LNA provides an RX gain of +13 dB. LNA's low noise figure (NF) is only 2.5 dB, ensuring improved RX sensitivity of Nordic Bluetooth 5 / Bluetooth Low Energy / Bluetooth LE, Thread, Zigbee, and 2.4GHz RF low-power wireless solutions .
5G and 400G data centers are twin-type synchronous development. It is expected that with the gradual landing of high-broadband applications in the 5G era, the burst of traffic will be on the order of tens of times.
the industry's smallest isolation devices for industrial automation and solar inverters.
Vishay Dale IHDF-1300AE-10 adopts iron powder core technology, with a maximum height of only 15.4 mm. It has low AC and DC power consumption and excellent heat dissipation in the severe operating temperature range of -55 ° C to +125 ° C. performance.
China has already started 5G services, and the accompanying 5G smartphones and related equipment will drive the global semiconductor market back to life.
The RX23W provides comprehensive Bluetooth® 5.0 Low Energy support, including long-distance and mesh networking capabilities, and achieves the industry's lowest level of receive mode peak power consumption at 3.0 mA.
G3VM-21MT can switch measurement signals in test equipment mainly used for electrical tests of semiconductor devices. In addition to MOS FET relays with small size and long life, G3VM-21MT is the world's first MOS-FET relay module with "T-shaped circuit structure".
In 2018, in the field of pan-industrial chips, fast-growing applications include network equipment, commercial aircraft, LED lighting, digital tags, digital video surveillance, climate monitoring, smart meters, photovoltaic inverters, and human-machine interface systems.
This three-phase brushless motor control pre-drive IC does not require a Hall sensor, and is suitable for many applications using high-speed fans, such as servers, blowers, cordless vacuum cleaners, robotic vacuum cleaners, etc.
In 2019, the total amount of parts and components purchased by Huawei from Japanese companies will reach 1.1 trillion yen (about 10 billion US dollars), a surge of more than 50% from 720 billion yen in 2018.
For cost-sensitive IoT devices that need to support Bluetooth® 5.0, ZigBee® 3.0 or OpenThread standards. This series offers a good link budget from 100dB in Bluetooth 5.0 mode to 104dB in 802.15.4 mode.
The STTS22H can improve asset trackers, container transport recorders, HVAC HVAC systems, air humidifiers, refrigerators, building automation systems And smart consumer temperature and heat flow monitoring.
Vishay BCcomponents MKP385e series devices have a maximum operating temperature of + 125 ° C (observed voltage derating), comply with IEC 60384-17 and AEC-Q200 standards (version D), 60 ° C, 93% RH temperature and humidity and bias voltage (THB ) Test up to 56 days.
Based on the Arm Cortex-M33 dual-core processor design, the nRF5340 integrates a high-performance application processor, programmable ultra-low-power network processor, and security functions in a low-power, multi-protocol SoC.
Compared to the ASi-3, the ASi-5 offers superior performance and availability, with cycle times as low as 1.27ms, cable lengths up to 200 meters, and support for 96 slaves per segment.
the new Microni300 1TB microSD card uses Micron's 96-layer 3D QLC NAND technology to capture and store high-quality video clips for more than three months in a video surveillance system.
The production capacity of 8-inch wafer chips has been obviously insufficient since 2018, and from the 2019, the 8-inch wafer production capacity remains, very nervous, especially in mainland China, in the case of a number of 12-inch production line, it seems that some 8-inch wafer capacity problems are ignored.
In addition to covering the frequency band below 1 GHz (400 MHz to 960 MHz), it also covers the 2.4 GHz band, providing universal compatibility. The LSI has very stable wireless characteristics even under varying environmental parameters such as voltage and temperature fluctuations.
These new Layerscape Access processors are compliant with the O-RAN Alliance specification for a variety of deployment scenarios, including Central Unit/Distributed Unit (CU/DU) and Radio Unit (RU), as well as integrated small base stations and client equipment (CPE) system.
the production capacity of MEMS/Sensor Fabs will increase by 25% between 2018 and 2023, and monthly production capacity increased to 4.7 million units (converted to 200nm wafers).