Supplier
Feb 24, 2016

Alliance Memory's AS4C16M16D2, AS4C32M16D2, AS4C64M8D2, AS4C64M16D2, AS4C128M8D2, and AS4C128M16D2 high-speed CMOS double data rate 2 synchronous DRAMs (DDR2 SDRAM) feature densities of 512 MB, 1 GB, and 2 GB in 60-ball 8-mm x 10-mm x 1.2-mm and 84-ball 8-mm x 12.5-mm x 1.2-mm FBGA packages.

Feb 24, 2016

E-Switch's ULV8 series offer multiple color-ring illumination options, multiple voltage options, a 25 mm panel cutout size, and SPDT or DPDT function.

Feb 24, 2016

The 3M EMI absorber AB5000SHF series consists of flexible soft metal flakes filler-loaded polymer resin and acrylic pressure sensitive adhesive

Feb 24, 2016

Amphenol’s Mini-SAS High Density connector system is the next generation SAS system that provides faster data rates and more bandwidth.

Feb 24, 2016

Alliance Memory's AS4C32M8D1, AS4C32M16D1A, AS4C64M8D1, and AS4C64M16D high-speed CMOS double data rate synchronous DRAMs (DDR SDRAM) feature densities of 256 Mb, 512 Mb, and 1 Gb, respectively.

Feb 24, 2016

Alliance Memory's AS4C4M16D1, AS4C8M16D1, AS4C16M16D1, and AS4C32M16D1 high-speed CMOS double data rate synchronous DRAMs (DDR1 SDRAM) feature densities of 64 Mb, 128 Mb, 256 Mb, and 512 Mb, respectively, in the 66-pin TSOP II package.

Feb 24, 2016

Alliance Memory's AS4C8M16S-7BCN and AS4C16M16S-7BCN high-speed CMOS synchronous DRAMs (SDRAM) features densities of 128 MB and 256 MB, respectively, in a 54-ball 8 mm x 8 mm x 1.2 mm TFBGA package.

Feb 24, 2016

Alliance Memory AS4C16M16MD1, AS4C32M16MD1, AS4C16M32MD1, AS4C64M16MD1, AS4C32M32MD1, and AS4C64M32MD1 provide reliable drop-in, pin-for-pin-compatible replacements for a number of similar solutions in high-bandwidth, high-performance memory system applications.

Feb 24, 2016

Alliance Memory's AS4C512M16D3L monolithic high-speed, low-voltage CMOS double data rate 3 synchronous DRAM (DDR3L SDRAM) features an 8 GB density 96-ball, 9 mm x 14 mm, lead (Pb)-free FBGA package.

Feb 24, 2016

Alliance Memory's AS7C316098A is a 16 M high-speed CMOS SRAMs in the 48-pin, 12 mm x 20 mm TSOP-1 package.

Feb 24, 2016

STMicroelectronics' DM2 MOSFETs featuring Qrr and trr is optimized for high-voltage full-bridge and half-bridge topologies requiring high switching performance.

Feb 24, 2016

TDK Corporation offers their high temperature resistant MLCCs with soft terminations, expanding the CGA series of MLCCs for automotive applications

Feb 24, 2016

Alliance Memory's extends its 64M and 128M lines of with the 2M x 32 AS4C2M32S and 4M x 32 AS4C4M32S high-speed CMOS synchronous DRAMs (SDRAM) are offered in the 90-ball 8 mm x 13 mm x 1.2 mm TFBGA package and 86-pin 400-mil plastic TSOP II package

Feb 24, 2016

Alliance Memory's AS6C3216 is a 33,554,432-bit low power CMOS static random access memory organized as 2,097,152 words x 16 bits or 4,194,304 words x 8 bits.

Feb 24, 2016

Tensility’s bio-compatible wearable wires are small, soft and flexible, extruded using TPU material tested to ISO 10993 standards for skin irritation.

Feb 24, 2016

Digilent’s Nexys Video™ ready-to-use board is a digital circuit development platform based on the latest Artix™-7 Field Programmable Gate Array (FPGA) from Xilinx.

Feb 24, 2016

Alliance Memory's AS4C1M16S-7TCN is a high-speed CMOS synchronous DRAM (SDRAM) with a low density of 16 Mb in a 50-pin, 400-mil plastic TSOP II package.

Feb 23, 2016

Murata's NCS3 series offers continuous output short circuit protection and certification to the internationally recognized UL60950 safety standard

Feb 23, 2016

EPCOS' NTC thermisotrs accurate temperature measurement is indispensable in order to initiate countermeasures in good time in the event of impending overheating

Feb 23, 2016

Omron now offers a MOSFET Relay capable of switching 1.7 amps in a 4 pin SOP package.