ATS has introduced its stamped heat sinks, or board level cooling solutions, specifically designed to cool power modules that come in a variety of TO packages.
Heat pipes from ATS offer high thermal-conductivity and are available in round or flat.
ATS' MaxiGRIP and SuperGRIP ClipKITS offers patented superGRIP™ and maxiGRIP™ technology available for straight fin, slant fin, cross cut and pin fin heat sinks
Advanced Thermal Solutions superGRIP™ Heat Sink
ATS STAR heat sinks offer superior thermal performance.
The BGA cooling solutions with maxiGRIP attachment come preassembled with high performance, phase changing, thermal interface materials.
High performance blueICE™ heat sinks feature an ultra-low profile for tough-to-cool applications.
The fanSINK heatsinks with maxiGRIP attachment feature omni-directional air flow for optimum thermal performance independent of the PCB layout.