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The Sil-Pad® K-10 Kapton-based insulator offers good cut-through properties and excellent thermal performance.
Q-Pad® 3 glass-reinforced grease replacement thermal interface can be installed prior to soldering and cleaning.
Gap Pad® 1500 unreinforced gap-filling material features thermal conductivity of 1.5 W/m-K and conformable, low-hardness.
Gap Pad® VO ultra soft for filling air gaps features thermal conductivity of 1.0 W/m-K and is designed for low-stress applications.
The Sil-Pad® 900S insulation material features thermal impedance of 0.61°C-in2/W (@50 psi) for applications including power supplies.