Thermally conductive pad for filling gaps, with a non-silicone resin for use in applications that may be sensitive to silicone oils.
TG-LH-EE-90 series products from t-Global are one-part, white, epoxy based adhesive developed specifically for fiber optic electronic applications.
T69 from t-Global is an ultra-high-performing pyrolytic graphite. It is used for applications where the highest possible thermal conductivity is required.
S606C is t-Global’s highest performing thermal grease. The product is ideally suited for cooling the most demanding of LED and electronic applications.
TG-LH-FBPE-80 is a black, epoxy potting compound that has excellent adhesion characteristics, good thermal transfer characdsteristics and wets most substrates.
NSP-35 is a one-part, fully-cured, non-silicone gap filler from t-Global.
Thermally conductive tubes from t-Global provide a dialectric breakdown voltage of 7KV and thermal conductivity of 1.3W/m-k for clip-mounted plastic power packages.
t-Global's two-piece dispensable gap filler that offers excellent design flexibility and thermal performance in applications with varied or uneven thermal paths.
t-Global's L37-3S ultra-soft gap filler has the ability to create a good thermal path and eliminate air gaps without damaging delicate components.
t-Global's comprehensive range of pre-cut thermal insulator pads that conveniently manage thermal transfer and electrical insulation.
t-Global's low-weight ceramic heat spreader offering excellent thermal conductivity and high dielectric breakdown.