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Renesas Electronics has resumed volume production at its 200 and 300 mm Naka wafer fabrication factory in Japan, which was closed following the March 11 earthquake. The company also moved its schedule up regarding when its supply capacity will return to pre-earthquake levels from October to September.
Renesas began test production on the 200 mm (8-inch) and 300 mm (12-inch) wafer fabrication lines on April 23 and April 25, respectively. The company said it achieved the same results as pre-earthquake levels in quality and reliability testing.
Mass production on both the 200 mm and 300 mm wafer fabrication lines was resumed on June 1 and June 6, respectively.
Renesas now expects it will be able to achieve pre-earthquake supply capacity levels by the end of September with additional supply from its other fabs and outside foundries. Earlier predictions had forecasted achieving supply capacity at the end of October.
Renesas is a leading supplier of microcontrollers, analog chips, and system on chip solutions.