Doc ID 1107 Rev 10
Symbol Parameter DIP16+2+2
Thermal resistance, junction to pin
The thermal resistance is referred to the thermal path from the dissipating region on the top surface of the
silicon chip, to the points along the four central pins of the package, at a distance of 1.5 mm away from the
Thermal resistance, junction to ambient
If a dissipating surface, thick at least 35 mm, and with a surface similar or bigger than the one shown in
, is created making use of the printed circuit. Such heatsinking surface is considered on the bottom
side of an horizontal PCB (worst case).
Thermal resistance, junction characteristics) to
If the power dissipating pins (the four central ones), as well as the others, have a minimum thermal
connection with the external world (very thin strips only) so that the dissipation takes place through still air
and through the PCB itself. It is the same situation of note 2, without any heatsinking surface created on
purpose on the board.
Thermal resistance junction-case