L6234PD013TR

L6234

Thermal data

Doc ID 1107 Rev 10

5/16

3 Thermal 

data

         

Figure 3.

Printed Heatsink

Table 3.

Thermal data

Symbol Parameter DIP16+2+2 

PowerSO20 

Unit 

R

th j-pin

Thermal resistance, junction to pin 

12 

(1)

1.

The thermal resistance is referred to the thermal path from the dissipating region on the top surface of the 
silicon chip, to the points along the four central pins of the package, at a distance of 1.5 mm away from the 
stand-offs.

 

°C/W 

R

th j-amb1

Thermal resistance, junction to ambient 

40 

(2)

2.

If a dissipating surface, thick at least 35 mm, and with a surface similar or bigger than the one shown in 

Figure 3

, is created making use of the printed circuit. Such heatsinking surface is considered on the bottom 

side of an horizontal PCB (worst case).

 

°C/W 

R

th j-amb2

Thermal resistance, junction characteristics) to 
ambient 

50 

(3)

3.

If the power dissipating pins (the four central ones), as well as the others, have a minimum thermal 
connection with the external world (very thin strips only) so that the dissipation takes place through still air 
and through the PCB itself. It is the same situation of note 2, without any heatsinking surface created on 
purpose on the board.

 

°C/W 

R

th j-case

Thermal resistance junction-case 

 

1.5 °C/W 

!-V

L6234PD013TR Datasheet Related Products:
L6234PD013TR Information:
Part No.
L6234PD013TR
Description
IC MOTOR DRIVER PAR 20POWERSO
File Size
501520 bytes
Page Size
595 x 842 pts (A4)
All Pages
16
Manufacturer
STMicroelectronics
Homepage
http://www.st.com/web/en/home.html
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