PCA9698BS,118

PCA9698

All information provided in this document is subject to legal disclaimers.

© NXP B.V. 2010. All rights reserved.

Product data sheet

Rev. 3 — 3 August 2010 

43 of 48

NXP Semiconductors

PCA9698

40-bit Fm+ I

2

C-bus advanced I/O port with RESET, OE and INT

Process issues, such as application of adhesive and flux, clinching of leads, board 
transport, the solder wave parameters, and the time during which components are 
exposed to the wave

Solder bath specifications, including temperature and impurities

16.4 Reflow soldering

Key characteristics in reflow soldering are:

Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to 
higher minimum peak temperatures (see 

Figure 43

) than a SnPb process, thus 

reducing the process window

Solder paste printing issues including smearing, release, and adjusting the process 
window for a mix of large and small components on one board

Reflow temperature profile; this profile includes preheat, reflow (in which the board is 
heated to the peak temperature) and cooling down. It is imperative that the peak 
temperature is high enough for the solder to make reliable solder joints (a solder paste 
characteristic). In addition, the peak temperature must be low enough that the 
packages and/or boards are not damaged. The peak temperature of the package 
depends on package thickness and volume and is classified in accordance with 

Table 16

 and

17

 

 

Moisture sensitivity precautions, as indicated on the packing, must be respected at all 
times.

Studies have shown that small packages reach higher temperatures during reflow 
soldering, see 

Figure 43

.

Table 16.

SnPb eutectic process (from J-STD-020C)

Package thickness (mm)

Package reflow temperature (

°C)

Volume (mm

3

)

< 350

 350

< 2.5

235

220

≥ 2.5

220

220

Table 17.

Lead-free process (from J-STD-020C)

Package thickness (mm)

Package reflow temperature (

°C)

Volume (mm

3

)

< 350

350 to 2000

> 2000

< 1.6

260

260

260

1.6 to 2.5

260

250

245

> 2.5

250

245

245

PCA9698BS,118 Datasheet Related Products:
PCA9698BS,118 Information:
Part No.
PCA9698BS,118
Description
IC I/O EXPANDER I2C 40B 56HVQFN
File Size
370946 bytes
Page Size
595.22 x 842 pts (A4)
All Pages
48
Manufacturer
NXP Semiconductors
Homepage
http://www.nxp.com/
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