PCA9698BS,118

PCA9698

All information provided in this document is subject to legal disclaimers.

© NXP B.V. 2010. All rights reserved.

Product data sheet

Rev. 3 — 3 August 2010 

42 of 48

NXP Semiconductors

PCA9698

40-bit Fm+ I

2

C-bus advanced I/O port with RESET, OE and INT

15. Handling information

All input and output pins are protected against ElectroStatic Discharge (ESD) under 
normal handling. When handling ensure that the appropriate precautions are taken as 
described in JESD625-A or equivalent standards.

16.  Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account 
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow 
soldering description”
.

16.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to 
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both 
the mechanical and the electrical connection. There is no single soldering method that is 
ideal for all IC packages. Wave soldering is often preferred when through-hole and 
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not 
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high 
densities that come with increased miniaturization.

16.2 Wave and reflow soldering

Wave soldering is a joining technology in which the joints are made by solder coming from 
a standing wave of liquid solder. The wave soldering process is suitable for the following:

Through-hole components

Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless 
packages which have solder lands underneath the body, cannot be wave soldered. Also, 
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, 
due to an increased probability of bridging.

The reflow soldering process involves applying solder paste to a board, followed by 
component placement and exposure to a temperature profile. Leaded packages, 
packages with solder balls, and leadless packages are all reflow solderable.

Key characteristics in both wave and reflow soldering are:

Board specifications, including the board finish, solder masks and vias

Package footprints, including solder thieves and orientation

The moisture sensitivity level of the packages

Package placement

Inspection and repair

Lead-free soldering versus SnPb soldering

16.3 Wave soldering

Key characteristics in wave soldering are:

PCA9698BS,118 Information:
Part No.
PCA9698BS,118

RFQ

Description
IC I/O EXPANDER I2C 40B 56HVQFN
File Size
370946 bytes
Page Size
595.22 x 842 pts (A4)
All Pages
48
Manufacturer
NXP Semiconductors
Homepage
http://www.nxp.com/
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