STTH60L06TV1

STTH60L06TV

Package mechanical data

 5/7

Package mechanical data

Epoxy meets UL94, V0

Cooling method: by conduction (C)

         

In order to meet environmental requirements, ST offers these devices in ECOPACKĀ® 
packages. These packages have a Lead-free second level interconnect . The category of 
second level interconnect is marked on the package and on the inner box label, in 
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering 
conditions are also marked on the inner box label. ECOPACK is an ST trademark. 
ECOPACK specifications are available at: www.st.com. 

Table 5.

ISOTOP dimensions

REF.

DIMENSIONS

Millimeters

Inches

Min.

Max

Min.

Max.

A

11.80

12.20

0.465

0.480

A1

8.90

9.10

0.350

0.358

B

7.8

8.20

0.307

0.323

C

0.75

0.85

0.030

0.033

C2

1.95

2.05

0.077

0.081

D

37.80

38.20

1.488

1.504

D1

31.50

31.70

1.240

1.248

E

25.15

25.50

0.990

1.004

E1

23.85

24.15

0.939

0.951

E2

24.80 typ.

 0.976 typ.

G

14.90

15.10

0.587

0.594

G1

12.60

12.80

0.496

0.504

G2

3.50

4.30

0.138

0.169

F

4.10

4.30

0.161

0.169

F1

4.60

5.00

0.181

0.197

P

4.00

4.30

0.157

0.69

P1

4.00

4.40

0.157

0.173

S

30.10

30.30

1.185

1.193

STTH60L06TV1 Datasheet Related Products:
STTH60L06TV1 Information:
Part No.
STTH60L06TV1
Description
DIODE FAST 600V 30A ISOTOP
File Size
124815 bytes
Page Size
595 x 842 pts (A4)
All Pages
7
Manufacturer
STMicroelectronics
Homepage
http://www.st.com/web/en/home.html
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